Principal Engineer

Company:

Qualcomm Technologies International Ltd

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

We are seeking a senior-level Low Power MSIC-Analog System Technologist with deep expertise in mixed-signal IC and system design and a proven record of chip-level technical leadership. This is a high-impact role responsible for defining the architecture, driving transistor-level design, and enabling system-level integration of ultra-low-power integrated circuits (ICs) for Robotics, Industrial IoT (IIoT) and XR applications.

The successful candidate will bridge high-performance Analog Front Ends (AFEs) with digital logic and firmware, leading programs from initial architecture and specification through simulation, verification, tape-out, and early silicon bring-up. This role requires strong cross-functional collaboration, sound architectural judgment, and the ability to operate effectively in ambiguous environments.

Qualifications

Advanced academic background in Electrical Engineering or a closely related field

Extensive industry experience in mixed-signal IC and system-level design

Demonstrated experience as a Chip Lead, System Architect, or Technical Lead

Proven ability to drive end-to-end silicon programs from concept to production

Strong capability to work independently and provide technical direction with minimal supervision

Responsibilities:

Architecture & Technical Leadership

Define and support end-to-end system architecture, including partitioning across analog, digital, firmware, and system domains

Drive architectural trade-offs across power, performance, noise, latency, and silicon area

Partner with chip leads and system leads from concept definition through silicon bring-up and validation

Mixed-Signal Design & Integration

Lead feasibility studies and transistor-level design of mixed-signal building blocks including ADCs, DACs, PLLs/DLLs, LDOs, and SerDes

Architect and integrate ultra-low-power AFEs optimized for battery-operated IIoT , XR and Robotics sensor ASICs

Architect of ultra-low power RF Wifi, BTE, and other communication systems as well as PMU design.

Drive full-chip execution in collaboration with internal teams and third-party IP vendors and design houses

Modeling, Verification & Silicon Execution

Develop behavioral and system-level models using MATLAB/Simulink (or equivalent tools) to evaluate noise, linearity, and SNR

Perform comprehensive pre-silicon verification across PVT corners using industry-standard simulators

Support post-silicon bring-up, characterization, and reliability qualification, including HTOL and burn-in

Collaborate with packaging, test, and system teams to ensure successful productization

System & Application Enablement

Support multi-modal sensor data acquisition, sensor fusion, and edge AI inference workflows

Contribute to hardware–software integration for efficient system-level deployment

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 7+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 6+ years of ASIC design, verification, validation, integration, or related work experience.

Minimum Qualifications

Ph.D. in Electrical Engineering (or related field) with 10-12 years of post-degree industrial IC/system design experience

OR

M.S. in Electrical Engineering (or related field) with 13-15+years of industrial IC/system design experience

Strong expertise in low-power analog and mixed-signal (AMS) IC design

Hands-on experience with Cadence Virtuoso, AMS sims, verilog and related analog design tools

Proficiency with Spectre, HSPICE, and board-level simulation methodologies

Solid understanding of PDKs, LVS, DRC, and PEX flows

Proven experience with ESD and reliability standards (HBM, CDM, TLP)

Preferred Qualifications

Experience with digital design flows, including synthesis and timing analysis

Familiarity with firmware development and software integration

Good knowledge of embedded interfaces such as I2C, I3C, SPI, I3S, and MIPI

Proficiency in Python/Matlab and/or similar scripting languages

Experience with deep submicron CMOS technologies and low-power fabrication processes

Exposure to IC packaging, board-level validation, and system bring-up

Background in sensor systems, sensor fusion, or edge AI applications

Soft Skills

Strong technical leadership and ownership mindset

Excellent cross-functional communication and collaboration skills

Ability to mentor and guide engineers across analog, digital, layout, and system domains

Strong analytical and problem-solving abilities

Comfortable making architecture-level decisions under ambiguity

Effective at managing external vendors, IP providers, and design partners

Results-driven with a strong focus on execution and quality

*References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.

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