Engineer R&D TGV

Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference.

To enhance our successful R&D Team in Leoben, Austria, we are looking for a passionate

Engineer R&D

In your role, you will support the design and development of new products by contributing to key technical activities within R&D projects. You will execute assigned engineering tasks, collaborating with cross-functional teams, and actively evaluating and adopting external technologies when needed to enable successful product development.

Your Responsibilities

Develop and optimize Through Glass Via (TGV) formation processes including laser modification and etching

Develop and optimize Singulation processes

Establish inspection and metrology methods for TGV characterization and singulation quality

Support downstream processes (seed, plating, CMP, reliability) by ensuring TGV quality meets integration requirements

Support the technical design and development of new products by executing assigned tasks and contributing to meeting AT&S’s performance and quality standards

Conduct research activities and perform experiments to support the development of solutions aimed at improving product performance and manufacturing processes

Analyze experimental data and provide input and recommendations to enhance product performance and improve process efficiency

Your profile

Bachelor’s or master’s degree in Electrical engineering, Materials Science, Chemical Engineering, Mechanical Engineering, Optics/Photonics, or a related field

3+ years of experience in laser micro-machining, glass material processing, or semiconductor packaging processes, in R&D or product development roles

Practical experience with laser systems and/or glass wet etching processes

Basic understanding of glass mechanical properties, including crack behavior and heat-affected zone control

Hands-on experience with analytical tools regarding inspection and metrology

Experience in advanced IC substrates, interposers, or packaging R&D is a plus

Strong technical aptitude with willingness to develop problem-solving skills further

Effective collaboration and communication skills

Fluency in English

Our Offer

A meaningful role with opportunities for long-term growth in an international environment

Chance to actively contribute to AT&S´ success and to create value

A structured and tailor-made onboarding program along with continual training opportunities

Modern company canteen with freshly prepared meals every day

Free parking spaces and e-charging stations

Diverse health measures and a wide range of employee benefits

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. The employment is in accordance with the Austrian Collective Agreement for the Electrical and Electronics Industry, employment group E-F, and we offer competitive salaries and additional benefits based on your performance, experience and qualification.